Quantum Matrix SOP (over molded) , with the evolution of smaller, denser, faster and lighter end products, it became necessary for Mems packages to be affordably manufacturable.

And it didn’t stop there. Quantum Matrix invested time and research into assuring quality and reliability with advanced designs, assembly equipment / processes and materials. The result is controlled package flatness, wire sweep, solder ability and delamination resistance.

Quantum Matrix now makes it possible for Mems designers, packaging engineers, circuit designers and component specifiers to work concurrently and succeed with its OMSOP product line.