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Our solution ranges from component to module level . car_wireOur major customer focus is on automotive, medical and mobile applications.  

Contract Manufacturing Services
  1. Package Contract Manufacturing Services
  2. Application Modules Contract Manufacturing Services

Packaging and module solutions

  1. Click here to view our list of  solution

Packaging solution providing company for the global market with wide range of services. Our Engineering and business skills makes us more convenient working  with multi talented customers and provide them satisfactory on time solutions. 

We provide packaging for all types of devices with different shapes and enclosure materials depending upon customer request.  

 


These products will be manufactured in class 10K clean room with normal semiconductor process (ex: wire bond and die-attach) and some special processes like gel-fill, Lid-attach and singulation systems supplied by our business partners

As contract manufacturer Quantum Matrix Sdn Bhd cooperates across continents with best-in-class technology partners to deliver optimized solutions for key-customers.

  • 1.        IP and license management
  • 2.        Analysis and mathematical modeling 
  • 3.        Sensor design/optimization 
  • 4.        Interfacing 
  • 5.        Evaluation logic
  • 6.        Fabrication 
  • 7.        Testing 
  • 8.        Packaging 
  • 9.        Qualification 
  • 10.     Supply chain management

Today forefront developments in the microsensor market are driven by globally available MEMS, CMOS, test and packaging production capabilities and not vice versa.

Our contract manufacturing business model also includes purchasing of globally available MEMS, packaging and ASIC IPs. We do not aspire to reinvent the wheel - we want satisfied customers as the result of on-shedule product development and outstanding project management.

You want your microsensor system in time - Quantum Matrix Sdn Bhd cooperates closely with your teams to respond to all your requirements and deliver a high-volume custom product ..

Fast growing solution providers for R&D related industry. Our advanced Engineering and business skills makes us more convenient working  with multi talented customers and provide them satisfactory on time solutions. Our holding company is well known Since 1997 for its wide range of services in the field of electronics and computer peripherals.  

Our Services

  • 1.        Design & Development Services
  • 2.        Packages
  • 3.        Customized Device Test & Calibration system
  • 4.        IP custom built process machines
  • 5.        Product design (Electro-mechanical)
  • 6.        Devices

Solutions

  • 1.        Automotive Control / Monitoring Systems
  • 2.        Industrial Products
  • 3.        Medical Products
  • 4.        Mobile systems
  • 5.        Air/Marine Systems
  • 6.        Commercial Products

Click here to view our list of  solution

Microsensor system development to customer's requirements

  1. Complete sensor system definition & evaluation
  2. Hardware & firmware development
  3. Calibration & test procedure development
  4. Highly reliable sensor system development
  5. Expedited firmware development
  6. Short time-to-market through reuse of analog and digital IPs
  7. Mathematical simulation of sensor system including sensor element
  8. System & sensor evaluation using characterization board
  9. Firmware development
  10. Silicon implementation of intelligent sensor interface based on IPs

Our Services

  • 1.        Design & Development Services
  • 2.        Dies3.        Customized Device Test & Calibration system  
  • 4.        IP custom built process machines
  • 5.        Product design (Electro-mechanical)
  • 6.        Devices

Solutions

  • 1.        Automotive Control / Monitoring Systems
  • 2.        Industrial Products
  • 3.        Medical Products
  • 4.        Mobile systems
  • 5.        Air/Marine Systems
  • 6.        Commercial Products

Click Here for more detail..........................................................................

  

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